- All sections
- C - Chemistry; metallurgy
- C23F - Non-mechanical removal of metallic material from surfaces; inhibiting corrosion of metallic material; inhibiting incrustation in general; multi-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
- C23F 4/04 - Processes for removing metallic material from surfaces, not provided for in group or by physical dissolution
Patent holdings for IPC class C23F 4/04
Total number of patents in this class: 32
10-year publication summary
8
|
6
|
7
|
2
|
0
|
1
|
2
|
0
|
0
|
0
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
AP Solutions, Inc. | 13 |
4 |
Seagate Technology LLC | 4228 |
2 |
FEI Company | 851 |
2 |
Hexagon Technology AS | 123 |
2 |
National University of Singapore | 2228 |
2 |
Tohoku University | 2526 |
2 |
Apple Inc. | 50209 |
1 |
Applied Materials, Inc. | 16587 |
1 |
Samsung Electro-mechanics Co., Ltd. | 4798 |
1 |
Headway Technologies, Inc. | 715 |
1 |
Lam Research Corporation | 4775 |
1 |
The Johns Hopkins University | 5377 |
1 |
CemeCon AG | 70 |
1 |
ConocoPhillips Company | 1657 |
1 |
Daisho Denshi Co., Ltd. | 7 |
1 |
Danmarks Tekniske Universitet | 902 |
1 |
Dynajoin Corporation | 2 |
1 |
Praxair S.T. Technology, Inc. | 133 |
1 |
Tianjin University | 695 |
1 |
William Marsh Rice University | 937 |
1 |
Other owners | 4 |